DOWN DOC OPASSDX Acid Bright Copper Plating Addictive
Ⅰ. Features
1. With the new generation deeply concentrated composite formulation, the plating layer leveling reaches as much as 95%.
2. With easy plating solutions control, the plating layer leveling is excellent.
3. The plating layer generally will not have pinhole, with low internal stress and especially strong ductility.
4. The plating solution has high stability; the galvanization surface is clear and bright, addresses the mist problem.
5. Impurity tolerance is high and plating solution has rather long lifespan.
6. The lower area can be leveled quickly. Uniform thickness of the higher electric voltage zone and lower electric voltage zone is achieved. It can be applied in the motor industry (for instance, aluminum wheels), plating on plastics and conventional hardware workpiece, and will achieve excellent effect.
II. Plating Solution Composition and Operating Condition
Raw materials and operation conditions
|
Scope
|
Standard amount
|
Copper sulphate
|
160-240 g/L
|
200 g/L
|
Sulphuric acid
|
40-90 g/L
|
60 g/L
|
Chloride ion
|
40-120ppm
|
70ppm
|
Initiator OPASSDX-MU
|
4-6 ml/L
|
5.0 ml/L
|
Leveler OPASSDX-A
|
0.3-0.6 ml/L
|
0.5 ml/L
|
Brightener OPASSDX-B
|
0.3-0.6 ml/L
|
0.4 ml/L
|
Temperature
|
18-35℃
|
25℃
|
Cathode current density
|
1-8 ampere/square decimeter
|
3-5 ampere/square decimeter
|
Anodic current density
|
0.5-3.0 ampere/square decimeter
|
0.5-3.0 ampere/square decimeter
|
Anode
|
Phosphor copper (Phosphorus content: 0.03-0.06%)
|
Phosphor copper (Phosphorus content: 0.03-0.06%)
|
Agitation method
|
Air or cathode waving
|
Air agitation
|