DOWN DOC  OPASSDX Acid Bright Copper Plating Addictive
OPASSDX Acid Bright Copper Plating Addictive

Ⅰ. Features
1. With the new generation deeply concentrated composite formulation, the plating layer leveling reaches as much as 95%.
2. With easy plating solutions control, the plating layer leveling is excellent.
3. The plating layer generally will not have pinhole, with low internal stress and especially strong ductility.
4. The plating solution has high stability; the galvanization surface is clear and bright, addresses the mist problem.
5. Impurity tolerance is high and plating solution has rather long lifespan.
6. The lower area can be leveled quickly. Uniform thickness of the higher electric voltage zone and lower electric voltage zone is achieved. It can be applied in the motor industry (for instance, aluminum wheels), plating on plastics and conventional hardware workpiece, and will achieve excellent effect.
 
II. Plating Solution Composition and Operating Condition
 
Raw materials and operation conditions
 
Scope
Standard amount
Copper sulphate
160-240 g/L
200 g/L
Sulphuric acid
40-90 g/L
60 g/L
Chloride ion
40-120ppm
70ppm
Initiator OPASSDX-MU
4-6 ml/L
5.0 ml/L
Leveler OPASSDX-A
0.3-0.6 ml/L
0.5 ml/L
Brightener OPASSDX-B
0.3-0.6 ml/L
0.4 ml/L
Temperature
18-35℃
25℃
Cathode current density
1-8 ampere/square decimeter
3-5 ampere/square decimeter
Anodic current density
0.5-3.0 ampere/square decimeter
0.5-3.0 ampere/square decimeter
Anode
Phosphor copper (Phosphorus content: 0.03-0.06%)
Phosphor copper (Phosphorus content: 0.03-0.06%)
Agitation method
Air or cathode waving
Air agitation